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NIRSpec OA development process of SiC components

NIRSpec OA development process of SiC components

Publication date: 26 July 2008

Authors: Honnen, K. et al.

Journal: Proceedings of SPIE, the International Society for Optical Engineering
Volume: 7018
Year: 2008

Copyright: SPIE

"Advanced Optical and Mechanical Technologies in Telescopes and Instrumentation". Edited by Atad-Ettedgui, Eli; Lemke, Dietrich. Proceedings of the SPIE, Volume 7018, pp. 70180R-70180R-13 (2008)

The NIRSpec OA (optical assembly) design largely relies on SiC components. The properties of the SiC material and very tight stability budgets required a dedicated development process. Starting from validation of design principles by breadboard testing, this paper describes the development process up to the SM test of the NIRSpec optical assembly. From breadboard testing the design of the mounting interface was established. The test programme also included gluing processes, torque free mounting of mirrors and verification of stability of friction joints. The basic design rules for the mirrors to cope with distortion of mirror surfaces due to bi-metallic bending effects and flatness deficiencies were derived. A modular design using 3 TMAs (Three Mirror Anastigmats) was followed for the OA. From the overall design, budget allocations and design loads for the TMAs were determined. The detailed design process was then driven by distortion budget allocations derived from optical analysis. Due to stringent stability requirements and high mechanical loads, most elements needed several design iterations to meet the budget allocations. Finally, distortions and displacements of the optical elements under the predictable in-orbit conditions were calculated and used in the optical model. The effects can be partially compensated by adjustment. The budget allocation was then revised to account for non-predictable effects only.
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