CHEOPS baffle and cover assembly support structure
The support structure for the Baffle and Cover Assembly (BCA) mounted on the dummy platform mounting panel and covered with multilayer insulation (MLI).
The CHEOPS instrument will be integrated onto the dummy platform mounting panel at the University of Bern. Then it will be shipped to EADS CASA Espacio S.L. where it will be integrated into the platform assembly.
The BCA, under the design responsibility of CSL/University of Liège and manufactured by Qinetic, is a key element of the science payload. The baffle provides the high level of straylight rejection needed to achieve the photometric precision crucial to the scientific success of CHEOPS. The protective cover prevents contamination of optical surfaces during advanced integration and launch. It will be opened, after launch, during the commissioning phase.