Elements of the CHEOPS instrument engineering model
![](https://cdn.sci.esa.int/documents/34122/35441/1567215677431-CHEOPS_instrument_EM_elements_April2016b_625.jpg)
Date: 07 April 2016
Satellite: CHEOPS
Copyright: ADS–Spain
The CHEOPS instrument engineering model is composed of three units:
the Focal Plane Module engineering model simulator (labelled CIS FPM EM);
the Sensor Electronic Module engineering model (labelled CIS SEM EM);
and the Back-End Electronics engineering model (not shown).
Last Update: 1 September 2019