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Elements of the CHEOPS instrument engineering model

Elements of the CHEOPS instrument engineering model


Date: 07 April 2016
Satellite: CHEOPS
Copyright: ADS–Spain

The CHEOPS instrument engineering model is composed of three units:
the Focal Plane Module engineering model simulator (labelled CIS FPM EM);
the Sensor Electronic Module engineering model (labelled CIS SEM EM);
and the Back-End Electronics engineering model (not shown).

Last Update: 1 September 2019
7-Dec-2021 19:08 UT

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