Elements of the CHEOPS instrument engineering model
Date: 07 April 2016
Satellite: CHEOPS
Copyright: ADS–Spain
The CHEOPS instrument engineering model is composed of three units:
the Focal Plane Module engineering model simulator (labelled CIS FPM EM);
the Sensor Electronic Module engineering model (labelled CIS SEM EM);
and the Back-End Electronics engineering model (not shown).
Last Update: 1 September 2019
