Asset Publisher

Elements of the CHEOPS instrument engineering model

Elements of the CHEOPS instrument engineering model


Date: 07 April 2016
Satellite: CHEOPS
Copyright: ADS–Spain

The CHEOPS instrument engineering model, pictured here, is composed of three units:
the Focal Plane Module engineering model simulator (the black box);
the Sensor Electronic Module engineering model (the gold-coloured box near the black box);
and the Back-End Electronics engineering model (the larger gold-coloured box).

Last Update: 1 September 2019
7-Dec-2021 17:59 UT

ShortUrl Portlet

Shortcut URL

https://sci.esa.int/s/WmQNylW

Also Available As

Related Images

Related Videos

Related Publications

Related Links

See Also

Documentation