Elements of the CHEOPS instrument engineering model
Date: 07 April 2016
Satellite: CHEOPS
Copyright: ADS–Spain
The CHEOPS instrument engineering model, pictured here, is composed of three units:
the Focal Plane Module engineering model simulator (the black box);
the Sensor Electronic Module engineering model (the gold-coloured box near the black box);
and the Back-End Electronics engineering model (the larger gold-coloured box).
Last Update: 1 September 2019
